≥1×10¹⁰ Ω・cm (elektrische Spezifikation des HPSI-Kerns)
Oberflächenbehandlung:
Einseitiges/doppelseitiges CMP-Spiegelpolieren
Micropipe-Dichte:
Massenproduktionsgrad ≤1 ea/cm²
Produkt-Beschreibung
Information of HPSI SiC Wafers HPSI (High Purity Semi-Insulating) silicon carbide wafers are critical foundational substrates for high-frequency GaN RF devices and advanced third-generation semiconductors. With the rapid expansion of 5G communication, millimeter-wave radar and aerospace electronics markets, the global SiC substrate market is projected to exceed USD 2 billion by 2030, playing an irreplaceable strategic role in next-generation wireless communication and high